Available Series
Select a series below to view detailed specifications and datasheets.
| Series | Temp Range | Type | Features | Action |
|---|---|---|---|---|
| Glass Encapsulated | -55°C to +250°C | High Precision | Heremetically sealed for harsh environments | View Datasheet |
| Epoxy Bead | -40°C to +125°C | General Purpose | Small size, fast response for air/surface | View Datasheet |
| Bare Chip (Die) | -55°C to +200°C | Hybrid/COB | Gold-wire bondable for micro-circuitry | View Datasheet |